Samtec adds 10 mm AcceleRate mP connectors with signal and power in one body, up to 64 Gbps PAM4
Samtec expanded its AcceleRate mP family with 10 mm stack-height UDM6 and UDF6 connectors that combine 64 Gbps PAM4 signals and 15 A power blades, saving board space.
Samtec has expanded its AcceleRate mP board-to-board connector family with versions at a 10 mm stack height, eeNews Europe reports. The new UDM6 and UDF6 connectors combine high-speed digital signaling and power delivery in a single connector and support data rates of up to 64 Gbps PAM4 eenewseurope.com
eeNews Europeeenewseurope.comOpen source ↗. The stated goal is to reduce PCB space requirements while carrying high current. The connectors are aimed at compact electronics for data centers, wireless infrastructure, industrial automation and aerospace applications.
Signal and power in one footprint
The AcceleRate mP connectors combine signal pins with high-power blades, which removes the need for separate power connectors and frees board area. Each power blade supports up to 15 A, with voltage ratings of 200 VAC or 283 VDC. Unlike conventional power connector arrangements, the blades run parallel to the length of the connector body. This 90-degree shift is intended to reduce crowding and improve heat dissipation.
On the signal side, the high-density open-pin-field array supports 64 Gbps PAM4 or 32 Gbps NRZ. Within the same connector, designers can configure single-ended signals, differential pairs and lower-speed power connections. Ground connections can be positioned to minimize crosstalk and manage impedance, which helps maintain signal integrity at high data rates.
Configurations and qualification
Samtec offers the AcceleRate mP family in 5 mm and 10 mm stack heights, giving options for different board spacing requirements eenewseurope.com
eeNews Europeeenewseurope.comOpen source ↗. The six-row open-pin-field architecture is available with 60, 120, 180 or 240 signal pins, alongside versions with four, six, eight or ten high-power blades. Listed applications include 5G and emerging 6G infrastructure, robotics, industrial instrumentation and aerospace systems.
The UDM6 and UDF6 connectors have also been certified under Samtec's Severe Environment Testing (SET) program, which evaluates components beyond conventional industry testing requirements. According to the report, this supports their use in demanding environments, including Class D space missions involving low Earth orbit (LEO) satellites, SmallSats and CubeSats. Technical specifications, 3D models and ordering information are available on Samtec's AcceleRate mP product page.
