Huawei HiSilicon CS5250: 50-MP image sensor found in the Xiaotu S7 Pro Max action camera
TechInsights identified Huawei's own 50-MP stacked BSI CMOS sensor in a production consumer camera and released preliminary data on die and pixel size.
On 8 November 2026, 3DNews reported that TechInsights had confirmed the first appearance in commercial equipment of a CMOS image sensor of Huawei's own design: the 50-megapixel HiSilicon CS5250. The analysts found it while disassembling the Xiaotu S7 Pro Max (XTU S7 Pro Max 4K) action camera. The sensor was created with the participation of Gkuvision, a supplier of image-processing solutions. 3dnews.ru
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How the sensor was identified
The component was identified while examining the camera's printed wiring board (PWB), where the specialists found the CS5250 marking. Because the sensor is installed in a production consumer device, it became available for technical study. Engineers opened the chip package and carried out a preliminary optical analysis.
Sensor parameters
According to the data obtained, the CS5250 is a stacked back-side illuminated (Stacked BSI) sensor. The die measures 11.57 × 8.67 mm, with an area of about 100.3 mm².
The active pixel array measures 10.09 × 7.57 mm, with a diagonal of 12.61 mm. A single pixel is 1.20 µm in size, and the color filter follows the Quad Bayer (2 × 2) scheme. 3dnews.ru
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In the market for compact and mobile image sensors, the companies present include Sony, Samsung, OmniVision, GalaxyCore and SmartSens. HiSilicon, Huawei's chip division, is now represented there by a sensor found in a serial product.
TechInsights noted that the current data are preliminary and reflect only the physical dimensions and the basic architecture of the sensor. More detailed technical reports will cover the internal structure of the stack, the readout technology and the image signal processor (ISP). The company will begin publishing them in early December.
