Winbond plans an EUV version of its 14nm DRAM process, targeting introduction in 2030

Winbond, a Taiwanese supplier of specialty DRAM and NOR flash, plans to adopt extreme ultraviolet (EUV) lithography, according to trendforce.com. President Pei-Ming Chen said, as reported by MoneyDJ, that the company intends to develop two generations of 14nm technology: one without EUV and one that incorporates it. The EUV version is targeted for introduction in 2030 if development proceeds smoothly. trendforce.comtrendforce.comtrendforce.comOpen source ↗

EUV and equipment lead times

Chen said EUV could reduce the multiple patterning steps required as circuit dimensions shrink, potentially shortening processing times and improving yields. Winbond has worked with ASML on EUV for about three and a half years, sending personnel for training, equipment trial runs and measurements. ASML has indicated that it could deliver Winbond's first EUV system in about two years, while subsequent systems would take around three and a half years at current lead times.

According to Nikkei, Chen said delivery times for some lithography and metrology tools now exceed two years. The company therefore has to place orders well in advance, amid competition from larger chipmakers such as TSMC. Construction of the new Kaohsiung fab is set to begin in December, with limited capacity expected in 2029 and a more significant production ramp-up in 2030.

Capacity, automotive and prices

Chairman Arthur Chiao said the capacity expansion started in the second half of 2025 is already progressing. Additional output is expected in 2027 and further increases in 2028, although growth will slow as cleanroom space reaches its limits, MoneyDJ reports. trendforce.comtrendforce.comtrendforce.comOpen source ↗

Chen said Winbond's automotive business has recorded strong growth this year. Automotive memory accounts for approximately 3% to 4% of the global memory market. Demand visibility has improved as major suppliers reduce DDR3, DDR4 and LPDDR4 supply, prompting customers to seek long-term supply agreements.

For the fourth quarter, Chen expects memory prices to continue rising, supporting further revenue growth at Winbond, though at a slower pace than in previous quarters. Chiao cautioned that further price increases could weigh on consumer demand: higher smartphone and PC prices could prompt consumers to delay upgrades. He added that data center installations planned for 2027 and 2028 are largely supported by earlier investment commitments, giving relatively clear visibility into DRAM demand, while supply will depend on how quickly manufacturers expand capacity.