Zhongwei ships first Primo Matrix plasma wafer dicing tool to a Chinese chip packaging customer

Zhongwei Semiconductor Equipment (Shanghai) Co. announced on 10 November that the first Primo Matrix dual-station plasma wafer dicing tool has been shipped to a major Chinese integrated circuit packaging customer, ithome.com reports ithome.comithome.comithome.comOpen source ↗. The company describes the series as its own development in plasma dicing for advanced packaging.

Primo Matrix uses the plasma deep silicon etching technology of Primo TSV, which is proven in volume production, and combines a dual-station etch chamber with a wafer transfer module. It handles framed 200 mm and 300 mm wafers, with 300 mm as the main platform. The tool suits dicing lane widths down to 5 μm and wafer thicknesses of 25–700 μm.

Built on the Primo platform, the system can carry up to 6 etch stations. It supports front-side plasma dicing of bumped wafers, plasma dicing after laser grooving and wafer backside etching. It can also etch openings in hard masks such as dielectric layers.

Over the next five years, the company plans to broaden its product range to cover about 60% of the high-end semiconductor equipment market and over 70% of the advanced packaging equipment market ithome.comithome.comithome.comOpen source ↗.